Electro Mechanical Engineer

• 300 mm wafer handling design (edge‑grip, vacuum, kinematic support)
• Precision chuck design & compliant mechanisms
• FEA (ANSYS, Abaqus, COMSOL) — stress, modal, and contact analysis
• Modeling warped/bowed wafers, thin‑plate mechanics
• Cleanroom design principles – ISO Class 1, low‑particle mechanisms
• Vacuum system design, leak‑tight sealing, He‑leak testing

Material selection for semiconductor tools:

• PEEK, Vespel, PTFE, PPS
• Alumina, Aluminum Nitride, Ti‑6Al‑4V
• Hard anodize, DLC, TiN, Parylene coatings

Motion system design:

• Linear motors, voice‑coil actuators, pneumatic micro‑actuators
• Flexures, guides, cross‑roller bearings
• Jerk‑limited (S‑curve) motion and soft‑landing control
• Edge‑grip mechanism design with low clamping forces
• Tolerance analysis, GD&T, DFMEA, DOE
• Semiconductor standards familiarity: SEMI M1, M49, E57, E84, ISO 14644

Metrology & Testing Skills

• Warp, bow, TTV measurement techniques
• Particle measurement and contamination control
• Vacuum integrity tests (helium mass spectrometer, pressure decay)
• Wafer alignment and edge detection sensors (optical/capacitive)
• Reliability testing for 24/7 fab duty